AMD Talks 3D Stacking at Rice Presentation

Posted by alphaatlas 10:47 AM (CDT)

Tuesday March 19, 2019

AMD has talked up their "chiplet" based approach used in their upcoming products, and according to some reports, Marvell is already selling products based on the chiplet concept. But the next logical step from that approach is to move from 2D to 3D, where different dies are "stacked" on top of each other. In a recent presentation at Rice University, AMD confirmed that they're working on 3D stacking techniques in their future designs, and that it's a necessary step to keep the improvements coming, but didn't elaborate much beyond that. Check out the memory and stacking talk in the presentation below: