TSMC Begins Volume Production of Enhanced 7 nm EUV Process Node in March

Posted by cageymaru 8:10 AM (CST)

Tuesday February 12, 2019

According to a report from DigiTimes, Taiwan Semiconductor Manufacturing Company (TSMC) will begin volume production of its new 7 nm EUV node in March. TSMC has reserved 18 of the 30 extreme ultraviolet (EUV) systems from Dutch lithography equipment manufacturer ASML. TSMC is on track to being risk production of its new 5 nm process node in Q2 2019. EUV is expected to be a key component of TSMC's 5 nm node. TSMC CEO CC Wei has previously disclosed that the foundry expects to "start taping out 5nm chip designs later in the first half of 2019 and move the node to volume production in the first half of 2020." He also discussed the growing client list for his foundry's 7 nm process node.

TSMC started volume producing 7nm chips in April 2018, with AMD, Apple, HiSilicon and Xilinx reportedly being among its major 7nm chip customers. The foundry will soon roll out its EUV-based 7nm process, which will boost its total 7nm chip sales to account for 25% of total wafer sales this year compared with 9% in 2018.