Date: Wednesday, July 18, 2018
For over 25 years Cooler Master has been supplying the globe with aftermarket PC components. One of the most popular aftermarket CPU coolers in the world is the Hyper 212 Evo (RR-212E-20PK-R2). Worth mentioning also is that the Hyper 212 EVO HSF has been around since late 2011. It is hardly new by anyone's standards, but Cooler Master has kept building it and keeping it on track with all modern sockets. We still see it referred to all the time in our forums. We reached out to Cooler Master for a review unit, but they turned us down. Understandably so, given that our testing criteria is likely "a bit much," for the little Hyper 212 EVO. That said, we wanted to know where it sits today when it comes to cooling highly overclocked Ryzen CPUs.
When we purchased ours, it was $35 at Amazon. Today it is at $22.50 at Amazon, and $20 at Newegg after a $10 MIR. So it is obvious why this cooler is so attractive to many, because many times it is just dirt cheap in terms of your hard earned dollars.
All that said, we wanted to give the 212 EVO a go and see where this inexpensive HSF would end up if you really put the screws to it. Enjoy!
Today's review takes place on our purpose built cooler testing system, featuring an AMD Ryzen R7 1700 overclocked to 3.9GHz, a GIGABYTE Aorus AX370-Gaming 5 motherboard, 16GB of Corsair DDR4 memory, and an ASUS GeForce GTX 670 DirectCU II TOP GPU. Full details of the test system and testing methodology can be found here.
Our AMD Ryzen 1700 CPU will be running at 3.9GHz across all cores and will be being stressed by Prime95 using Small FFTs in both our CPU only test, as well as our combined testing. Our CPU Package power measures ~170 watts under full load.
In combined testing our GTX 670 will be running Furmark in addition to Prime95. This puts an additional 250 watts of heat into the system that the cooler will have to contend with.
Testing is being performed in our Obsidian Series 750D Airflow Edition Full Tower ATX Case. Chassis fans include two Corsair 120mm fans pulling intake duty in the front, and a Corsair 140mm fan exhausting in the rear.
Fans are set to a locked 60% speed during all testing, as we found that is the best balance between performance and noise.
Thermal compound being used is Promilatech PK-3 Nano Aluminum. This is a very viscous compound rated at 11.2 W/m and requires no burn in or setup time.
Ambient temperature will be kept at as consistent temperature as possible for the duration of the tests. Temperatures are being measured in 4 places during both tests using our Sperry DT-506 Quad Input Thermometer, case intake, cooler/radiator intake, cooler/radiator exhaust, and case exhaust.
Average idle temperatures will be recorded after a thirty minute period of system inactivity.
Load temperatures are measured every 5 minutes from all four points with the Sperry DT-506 thermometer, as well as the CPU Temperature (Tdie) and Package Wattage as reported in HwiNFO 64. Both the CPU only as well as the combined tests are 1 hour long, at which point the average temperatures will be used as our data point.
Sound levels will be measured with a BAFX Products BAFX3370 Digital Sound Level Meter from a distance of four feet away from the side of the case. With everything turned off and the room completely "silent," the meter registered a sound level of 39dB(A).