Date: Monday , January 08, 2018
Corsair has been in the All-In-One cooler game for a long time and make some of the most popular units in the industry when it comes to cooling your CPU with a sealed system. Today we are putting its largest cooler to date to the test, the H150i PRO RGB, with a 360mm radiator and Corsair's ML series magnetic levitation fans. The H150i PRO RGB is officially being launched this morning (which is now done), so official specification pages and retail sales pages are now linked. Now let's see if bigger really is better.
Today's review takes place on our purpose built cooler testing system, featuring an AMD Ryzen R7 1700 overclocked to 3.9GHz, a GIGABYTE Aorus AX370-Gaming 5 motherboard, 16GB of Corsair DDR4 memory, and an ASUS GeForce GTX 670 DirectCU II TOP GPU. Full details of the test system and testing methodology can be found here.
Our AMD Ryzen 1700 CPU will be running at 3.9GHz across all cores and will be being stressed by Prime95 using Small FFTs in both our CPU only test, as well as our combined testing. Our CPU Package power measures ~170 watts under full load.
In combined testing our GTX 670 will be running Furmark in addition to Prime95. This puts an additional 250 watts of heat into the system that the cooler will have to contend with.
Testing is being performed in our Obsidian Series 750D Airflow Edition Full Tower ATX Case. Chassis fans include two Corsair 120mm fans pulling intake duty in the front, and a Corsair 140mm fan exhausting in the rear.
Fans are set to a locked 60% speed during all testing, as we found that is the best balance between performance and noise.
Thermal compound being used is Promilatech PK-3 Nano Aluminum. This is a very viscous compound rated at 11.2 W/m and requires no burn in or setup time.
Ambient temperature will be kept at as consistent temperature as possible for the duration of the tests. Temperatures are being measured in 4 places during both tests using our Sperry DT-506 Quad Input Thermometer, case intake, cooler/radiator intake, cooler/radiator exhaust, and case exhaust.
Average idle temperatures will be recorded after a thirty minute period of system inactivity.
Load temperatures are measured every 5 minutes from all four points with the Sperry DT-506 thermometer, as well as the CPU Temperature (Tdie) and Package Wattage as reported in HwiNFO 64. Both the CPU only as well as the combined tests are 1 hour long, at which point the average temperatures will be used as our data point.
Sound levels will be measured with a BAFX Products BAFX3370 Digital Sound Level Meter from a distance of four feet away from the side of the case. With everything turned off and the room completely "silent," the meter registered a sound level of 39dB(A).